Print version Application Tips
Thermoelectric cooler (TEC) is a semiconductor device which is characterized by unique heat pump performance with high efficiency, compactness and durability. The unique ability of TECs to heat and cool, permits them to lower temperature of an object below ambient as well as to stabilize temperature of objects in widely varying ambient conditions.
Here we mention some application tips that can help in optimal use of TECs.
MOUNTING OF TECS
The efficiency of TEC depends on the quality of mounting an object to be cooled onto TEC and the TEC onto heat rejecting elements. There are three widely applied methods that are used for TEC mounting:
- Mechanical mounting (compression method)
- Soldering
- Adhesive bonding.
Each of the listed methods has its own areas of applications, both advantages and disadvantages. When choosing an optimal way of mounting a TEC and cooled objects it is necessary to be guided by features of the methods and preferable field of applications.
Mechanical Mounting
Applications
- Permanent bonding is not
desired
- Multiple TECs are used
- TECs of large size
Advantages
- Easy mounting and dismounting procedures
- Low effect of mismatching of TEC and heat sink materials TCE
Disadvantages
- Extra space for fixtures
- Heat load from fixing parts
- Low thermal conductivity
- Not useful for mini TECs
- Limited temperature application
Soldering
Applications
- Miniature TECs
- High-strength junction
- Vacuum applications
- Long operation at high
temperatures
Advantages
- Minimal outgassing
- High mechanical strength
- High thermal conductivity
- Availability of mounting and dismounting
Disadvantages
- Most complex mounting procedure
- Risk of TEC damage during procedure
- Not for large size TECs
Adhesive Bonding
Applications
- Miniature TECs
- High-strength junction
- Minimal mounting tools
Advantages
- Easy mounting procedure
- Minimal requirements to TEC surface finish - blank ceramics
Disadvantages
- Moderate thermal conductance
- Permanent attachment
- Outgassing limits vacuum use
- Limited operation temperature
Soldering is most preferable mounting method for miniature single and multistage TECs.
Soldering is most complicated mounting method which required professional personnel and tools.