Thermoelectric cooler (TEC) is a semiconductor device which is characterized by unique heat pump performance with high efficiency, compactness and durability. The unique ability of TECs to heat and cool, permits them to lower temperature of an object below ambient as well as to stabilize temperature of objects in widely varying ambient conditions.
Here we mention some application tips that can help in optimal use of TECs.
TEC module is placed between two heat exchangers (plates) fixed by screws. For good thermal conductance the clearances between the plates are filled with thermal conductive grease or heat-conducting gasket.
The method is widely applied for mounting of large single-stage TE modules and when permanent TEC mounting bonding is not desired.
Advantages of the mechanical method of installation are a possibility to disassemble of the construction and, consequently, maintainability of a design.
Mechanical mounting is not applied to most of TEC micromodules applications as the mechanical installation demands extra space. Passive heat fluxes through the elements of fixtures reduce TEC performance, which is crucial for micromodules efficiency, especially in case of multi-stage TECs.