Thermoelectric cooler (TEC) is a semiconductor device which is characterized by unique heat pump performance with high efficiency, compactness and durability. The unique ability of TECs to heat and cool, permits them to lower temperature of an object below ambient as well as to stabilize temperature of objects in widely varying ambient conditions.
Here we mention some application tips that can help in optimal use of TECs.
The TEC is glued by thermal conductive glue (usually epoxy based compound filled with conductive powder) to header/heat sink, and a cooled object is glued by a similar way on the cold side of the TE module.
The thermal contact and mechanical durability are provided by gluing.
The method application is similar to that of soldering: it is mostly applied to single- and multistage micromodules.
The application for powerful modules is limited due to possible mechanical strains due to thermal expansion.
Unlike the mechanical installation it does not demand any additional elements occupying the area. In contrast to the soldering method it does not demand any intensive heating of the mounted surfaces, accurate control of temperatures and a special equipment for high temperature.
Disassembly of mount is complicated or impossible. Usually it is not recommended to heat it up above 150-160°C. Vacuum applications are restricted because of outgassing. Epoxy is sensitive for some chemicals - solvents.