Thermoelectric Cooling Solutions

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Thermoelectric coolers

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MX Group


The MX Group of thermoelectric coolers contains 2-stage TECs with enlarged cold side and special combination of Imax/Umax parameters. MX TE coolers are developed and optimized mainly for sensing applications (X-Ray and IR). Additionally to enlarged cold ceramics MX TECs have specific electrical connections inside. It is a special mix of serial and parallel connections of TEC internal elements that provides a unique balance between cooling capacity, dT and power consumption. Thermoelectric coolers from MX group are optimal choice for X-Ray and IR- applications with large cold side required for detector elements. Thermoelectric coolers can be manufactured on regular and thin ceramics. It provides certain flexibility for TEC height variations. Al2O3 ceramics is applied by default, AlN ceramics is available as an option.

MX TECs were developed by RMT separately to general thermoelectric coolers series. MX TECs have quad shape with the same dimensions for hot and cold sides, different to typical pyramidal shape of multistage TE coolers. The optimal balance of parameters and additional flexibility in TEC height variations by ceramics thickness allow to replace single-stage TE coolers in sensing applications keeping the same geometry.

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Example 1 - 2MX04-043-0510 on TO-8 12 header,
2-stage TEC, 8x8mm2 cold side
Example 2 - Switching from single-stage TEC to 2-stage
MX TE coolers type (click to zoom)

Thermoelectric coolers MX Group
Performance table at 27C, vacuum.
Performance table at 50C, N2.


Important Note:MX Series TECs can be manufactured on standard 0.5mm and thin 0.25mm ceramics. This adds an additional flexibility to performance and height optimization in a particular application. It is also possible to combine various ceramics thicknesses to achieve the most optimal results for TEC height.

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Please, use On-Line Assistant to find the most optimal thermoelectric cooler by dimensions and performance parameters. The detailed analysis of TEC performance and power consumption can be made with free TECCad software for Windows or special iTECPad app for iPad (available free on App Store).


  1. TEC Assempling
    1. Solder SnSb (Tmelt=230°C)
    2. Solder AuSn (Tmelt=280°C)
  2. Ceramics
    1. Pure Al2O3 (100%)
    2. Alumina Al2O3 (96%)
    3. Aluminum Nitride (AIN)
  1. Surface finish
    1. Blank ceramics (not metallized)
    2. Metallized (Au plating)
    3. Metallized and pre-tinned with:
      1. Solder 117 (InSn, Tmelt=117°C)
      2. Solder 138 (SnBi, Tmelt=138°C)
      3. Solder 143 (In-Ag, Tmelt=143°C)
      4. Solder 157 (In, Tmelt=157°C)
      5. Solder 183 (PbSn, Tmelt=183°C)
      6. Optional (specified by Customer)
  1. Thermosensor (optional)
    • Can be mounted to cold side ceramics edge. Calibration is available by request.
  2. Terminal contacts:
    1. Blank, tinned Copper
    2. Insulated Wires
    3. Insulated, color coded

Information furnished by RMT Ltd is believed to be reliable. However no responsibility is assumed for possible inaccuracies or omission. Specifications are subject to change whithout notice.