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Hi-TEC - High Performance Thermoelectric Coolers for High Heat Load applications
Mar 11, 2010
RMT Ltd introduces thermoelectric coolers, optimized for high-power LD applications in HHL form-factor. High-performance thermoelectric coolers of MC06 and MX06 Series with cooling capacity starting from 28W and higher provide significantly better cooling performance than any standard solutions available on the market.
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RUSNANO to Finance Production of Thermoelectric Microcoolers
Mar 10, 2010
The Russian Corporation of Nanotechnologies (RUSNANO) has approved financing for RMT's project to expand production of thermoelectric micro-cooling systems. learn more
New Catalog TEC2010
Jan 19, 2010
New Catalog TEC2010 of RMT thermoelectric products is available from now. learn more
Single step to Multistage - the simple way to increase cooling level in detector applications
Jan 8, 2010
RMT Ltd introduces 2-stage thermoelectric cooler designed for simple substitution of standard single-stage 8x8mm TE coolers in various detector applications to archive higher cooling level. 8x8mm thermoelectric cooler on TO-8 style header is the one of typical solutions for X-Ray detectors and some IR sensing applications.
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4-stage Cooling for Photodetector applications - new solution on standard TO-8 headers
Sep 25, 2009
TEC Microsystems GmbH introduces two special Thermoelectric Cooling sub-assemblies on standard TO-8 headers for HgCdTe Photodetector Applications. The existing single solution on TO-8 headers with 4MD04-116-xx type is supplemented with new thermoelectric cooler type - 4MD04-160-xx TEC. Based on RMT HD technology 4MD04-160-xx TE cooler has the increased cooling capacity and unique size, sufficiently compact to fit on standard TO-8 headers. New thermoelectric sub-assembly provides up to 125 degree of maximum temperature difference and up to 0.8W cooling capacity. Both 4-stage thermoelectric cooling sub-assemblies are oriented mainly for Mercury Cadmium Telluride photodetectors and some other applications where operating at temperatures below 200K is required.
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Z-Meters - Universal Solution for Thermoelectric Coolers Measurements and Quality Control
Aug 11, 2009
Thermoelectric (Peltier) Coolers (TECs) are the important part of a range of optoelectronic applications. Semiconductor lasers, DPSS lasers, Superluminescent diodes, Infrared and X-Ray detectors, Photon Counters, CCD and CMOS Imagers, DNA cyclers, Medical Calorimeters and many other products require built-in miniature TECs for thermal management.
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Black Body Task - New Range of Thermoelectric Thermal Reference Source (TTRS) Product
Jul 22, 2009
TEC Microsystems introduces new range of Thermoelectric Thermal Reference Source (TTRS) products based on TO-8, TO-3 and TO-822 headers. Thermoelectric Thermal Reference Source (TTRS) sub-assemblies provide a temperature-controllable, uniform-temperature, high-emissivity surface that is used in calibrating of infrared (IR) detector arrays and FLIR systems.
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Power to Butterfly - New Series of Miniature Thermoelectric Coolers with increased Cooling Capacity
Jul 7, 2009
Modern applications in optical fibercom industry require more heat power to dissipate. Various High Power Tunable Lasers need a significant amount of heat to be dissipated for optimal performance and stable wavelength. Sometimes typical telecom TECs of 23, 29, 35 couples in de-facto standard Butterfly packages are not suitable for temperature stabilization in high power applications. Developers and manufacturers have to switch for larger and more powerful TECs, but such types require more space and don't fit in standard Butterfly package.
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Split and Concat - Elongated Thermoelectric Cooling Solutions
May 14, 2009
In a certain amount of applications a thermoelectric (Peltier) cooler with elongated shape is required. For instance, DPSS (Diode Pumped Solid State Lasers) may need TEC with rectangular shape to fit pump module and a holder with crystal, and some of them may need more space than typical telecom TEC dimensions can provide
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Laser Marking Service for Thermoelectric Sub-Assemblies is available now
May 12, 2009
TEC Microsystems introduces new option available for Thermoelectric Sub-Assemblies. Headers and Packages with mounted thermoelectric coolers now can be marked with laser marking. It simplifies quality control, stock operation and identification process on customer side.
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