Power to Butterfly - New Series of Miniature Thermoelectric Coolers with increased Cooling Capacity
Jul 7, 2009
The alternative and more optimal way could be to develop thermoelectric coolers with increased cooling capacity, that will fit in standard Butterfly package. RMT Ltd presents new 1MDL06 Series of Miniature Thermoelectric Coolers for telecom applications. All TECs have the same dimensions of cold ceramics as typical telecom TECs - 6.0x8.2, 6.0x10.2, 6.0x12.2mm - standard sizes for 23, 29 and 35 couples TECs. But the cooling capacity of TECs is increased for more than 40% if to compare with standard thermoelectric coolers or even twice with additional steps.
Based on RMT Ltd High Density pellets placement technology thermoelectric coolers of 1MDL06 Series have about 40% more pellets (Bi-Te elements inside TEC) on the same size as standard TEC type. Together with ultra-low profile pellets of 0.3mm height it increases cooling capacity of TEC more than twice. For instance, typical 23 couples TEC has about 5.2-5.6W of max cooling capacity, meanwhile it's analog from new 1MDL06 Series has max 12.6W of cooling capacity, more than twice higher. The brief product map is specified below:
1MDL06-042-xx TEC with Wire and WB Solution | 
Standard 29 Couples TEC and 1MDL06-042-xx with high-density pellets placement technology (Top Ceramics is removed) |
1MDL06 TECs Cooling Power, Qmax, W
Thus, the applying of new 1MDL06 TECs may reduce power consumption in standard application for about 30%.
Also, the constructional advantage of 1MDL06 TECs is in front porch for wire and WB solutions. Each TEC of new 1MDL06 Series is compatible with applications, where Wire Bonding connection methodВ is applied. 1MDL06 TECs are provided with Au pads for WB, but also can be equipped with various WB posts to simplify Wire Bonding.
1MDL06 TECs are available on thin 0.25mm ceramics and standard 0.5mm. Total TEC height may very from ultra-thin value of 0.9mm to 2.6mm depending of application geometry and performance requirements. All TECs are assembled with high temperature lead-free Sn-Sb Solder 230 (Tmelt=230ºC), providing them completely RoHS compliant.
