Application Tips

Thermoelectric cooler (TEC) is a semiconductor device which is characterized by unique heat pump performance with high efficiency, compactness and durability. The unique ability of TECs to heat and cool, permits them to lower temperature of an object below ambient as well as to stabilize temperature of objects in widely varying ambient conditions.

Here we mention some application tips that can help in optimal use of TECs.

• Mounting

  • Mechanical
  • Soldering
  • Gluing

• Power Supply

  • DC or PWM
  • Ripples
  • PID Control

• Environment

  • High Temperature
  • Dew Point
  • Convection

• Handling

  • Static Loads
  • Vibration & Shocks

• Heat Dissipation

  • Headers
  • Heat Sinks

• Reference Data

  • Material Properties

• Brief Summary

SUMMARY

• Soldering is preferable mounting method for miniature single and multistage TECs.
• Soldering is most complicated mounting method which required professional personnel and tools.
• Combination of proper handling, and proper assembly techniques will yield an reliable TEC system.
• Thermoelectric material is strong in both tension and compression, but tends to be weak in shear.
• TEC is DC current semiconductor device.
• DC Closed Loop Temperature Control is preferable.
• PWM has large disadvantage for TEC control.
• Relay regulation gives ripples of temperature and can reduces TEC lifetime.
• DC Control of TEC always has advantage over PWM.
• Limit the ripple factor of power supply to less than 10%.
• Never use TEC without heat sink.
• Try to exclude redundant overheating of TECs.
• Proper heat sink contribute to TEC efficiency.
• Composite materials Copper-Tungsten and Copper-Molybdenum are preferable for TEC holders.
• Include gas ambient conditions in thermal management considerations.
• For multistage TEC cooling dry gas ambient is required or vacuum arrangement is preferable.
• Deeper cooling (multistage TECs) - more negative influence of gas.
• Worth case - dry air, best - inert heavy gases like as xenon, krypton.