Thermoelectric Cooling Solutions

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TO-8 and TO-66 TE sub-Assemblies update

Nov 7, 2008

New thermoelectric TO-8 and TO-66 Sub-Assemblies types are available. The standard range of TO-8 and TO-66 Sub-Assemblies is expanded with new TECs from MD Series, single- and multistage types. MD Series high-density pellets conception provides more pellets on the same size or more compact TECs with the same number of pellets as regular types. This means the availability of more powerful TECs for TO-8 or TO-66 Headers applications, or a possibility to apply TECs that were not able to fit on TO-8 or TO-66 headers previously ( for example it is possible now to mount 4-stage TEC onto typical TO-8 header). MD TECs solutions expand the thermoelectric cooling possibilities for applications where TO-8 and TO-66 headers are typically used:
  • DFB Laser Diodes
  • Quantum Cascade Lasers
  • Superluminescent Diodes



  • X-Ray Detectors
  • Infra-Red Detectors
  • Avalanche Photodiodes


The range of new thermoelectric MD TEC Sub-Assemblies with performance parameters are specified below. Please, select datasheet picture to download the complete datasheet with a drawing and performance plots.

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