Thermoelectric Cooling Solutions

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TO-3 TE Sub-mounts - higher cooling power within the same size

Jul 8, 2008

RMT Ltd introduces new high-power thermoelectric cooling solution for TO-3 headers applications. It based on new thermoelectric coolers with high-density pellet placement.

The standard thermoelectric cooler (TEC), used for TO-3 headers applications usually contains max 30 pellets pairs (60pcs BiTe posts) inside and can provide up to 6.3W of cooling power. This is a very standard TE cooler type, used for laser diode applications on TO-3 headers. For example this is 1MC06-030-05 according to RMT type nomenclature system.

The new type - 1MD06-049-05 - has 49 pellet pairs (98pcs BiTe elements) inside with the same TEC total dimensions - 8x8mm. And it provides up to 10.6W of cooling power.



1MD06-049-xx TEC type is based on new high density pellet placement technology. The distance between pellets is reduced to 200um against standard 400um. Reducing of the distance between pellets provides a space to fit more pellets inside TEC, which increases thermoelectric module cooling capacity. New 1MD06-049-xx thermoelectric module has five standard height and performance options available. Please, download the datasheet here. The most powerful one is 1MD06-049-05 with 0.5mm pellet height.

RMT Ltd provides new 1MD06-049-xx thermoelectric module type separately, as well as with a complete Thermoelectric Sub-Mount (TEC + Header assembled) on TO-3 header. Different TO-3 header types available. Please, download a complete datasheet for TE Sub-mount here.

Please, check the TO-3 Sub-mounts assembling description and available ordering options here.

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