Metallized ceramics

Ferrotec-RMT has a unique patented technology for manufacturing ceramic plates with metallization on substrates made of Al₂O₃, AlN, SiN and other materials.

Ferrotec-RMT provides a full range of services for the manufacture of single and double-sided PCBs from ceramics using patented technology. The company's know-how allows to produce high quality ceramic substrates and printed circuit boards on Al₂O₃, AlN and other materials. Key advantages are topology manufacturing accuracy, high quality processing, excellent solderability and metallization adhesion.

Ferrotec-RMT technology offers significant advantages over typical thin- and thick-film metallization processes.

Ferrotec-RMT enables rapid development and production of metallized ceramic substrates and ceramic PCBs for laser diodes, optoelectronics, RF and other applications.

Parameter	Dimensions	Units	Comments
Substrate footprint, max	60.0 x 48.0	mm	Other dimesnions by request
Substrate thickness	0.15; 0.25; 0.38, 0.5; 0.63; 0.76, 0.89, 1.0	mm	Other dimesnions by request
Substrate surface
- polished	Ra < 0.1	um
- lapped	Ra < 0.4	um
Pattern properties
Stripe width, min	0.1	mm
Between stripes, min	0.07	mm
Metallization adhesion	> 2	kg/mm²
Via-holes diameter, minimum	0.2	mm
Alignment accuracy	20	um	For double-sided patterns
Metallization
Adhesion layer (Cr, V, Ti)	< 0.1	um
Conductive layer (Сг)	25	um
Barrier layer (Ni)	3	um	Other dimesnions by request
Finishing layer (Au)	0.2 - 0.3	um	Otherdimesnions by request
Processing
Laser	+
Dicing	+