组件封装
Ferrotec-RMT performs assembly operations of thermoelectric modules into standard and special metal-glass and metal-ceramic packages. Joint development of packages together with the customer is possible. 在线选型
Packages options
Ferrotec-RMT thermoelectric modules can be mounted in any standard or specially designed package. Below are the most popular headers and packages used for thermoelectrically cooled laser diodes, detectors and sensors for optoelectronic applications.

TO-8
Metal-glass headers for IR, XRF detectors.
展开更多

TO-39 (TO-5)
Metal-glass headers for IR detectors.
展开更多

TO-46
Metal-glass headers for low-power lasers with thermal stabilization
展开更多

TO-66
Metal-glass headers for IR and other detectors with mounting holes.
展开更多

TO-37
Metal-glass headers for IR and other detectors with mounting holes
展开更多

TO-13
Metal-glass headers for IR and other detectors with mounting holes
展开更多

HHL
Package for high power laser diodes
展开更多

Butterfly
Metal-ceramic and metal-glass Butterfly type packages for lasers with thermal stabilization
展开更多

PS-28
Metal-glass packages for detectors and sensors with a large number of pins
展开更多

TOSA
Ceramic metal packages for telecommunication applications
展开更多

HTCC & LTCC
Thermally stabilized packages for CCD and CMOS matrix
展开更多