Assemblies with modules

Ferrotec-RMT performs assembly operations of thermoelectric modules into standard and special metal-glass and metal-ceramic packages. Joint development of packages together with the customer is possible. ON-LINE TEC SELECT ASSISTAN

Packages options

Ferrotec-RMT thermoelectric modules can be mounted in any standard or specially designed package. Below are the most popular headers and packages used for thermoelectrically cooled laser diodes, detectors and sensors for optoelectronic applications.

TO-8

Metal-glass headers for IR, XRF detectors.

TO-39 (TO-5)

Metal-glass headers for IR detectors.

TO-46

Metal-glass headers for low-power lasers with thermal stabilization

TO-66

Metal-glass headers for IR and other detectors with mounting holes.

TO-37

Metal-glass headers for IR and other detectors with mounting holes

TO-13

Metal-glass headers for IR and other detectors with mounting holes

HHL

Package for high power laser diodes

Butterfly

Metal-ceramic and metal-glass Butterfly type packages for lasers with thermal stabilization

PS-28

Metal-glass packages for detectors and sensors with a large number of pins

TOSA

Ceramic metal packages for telecommunication applications

HTCC & LTCC

Thermally stabilized packages for CCD and CMOS matrix