13 - 15 March 2018 RMT Ltd participates in OFC - the Optical Networking and Communication Conference & Exhibition, held in San Diego Convention Center, San Diego, California, USA. Visit us at booth 2644 to see the company products, to get to know about most recent company’s innovations and to meet in person RMT Ltd management. learn more

RMT has developed TECs with option especially for SMD mounting. These TECs can be mounted on printed circuit boards (PCB), ceramic boards, hybrid integrated circuits, etc. by standard SMD method. learn more

In 2017 RMT has developed new series of miniature thermoelectric coolers (TECs) suitable for applications in which resistance to high humidity is required.
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RMT has developed new single-stage thermoelectric Peltier coolers (TECs) suitable for applications in which durability to cyclic temperature changes is required. These are so-called cycling TECs. They are characterized by high heating or cooling rates up to 20°C/sec and the ability to ensure stable operation in reversal polarity of applied voltage during hundreds of thousands (up to a million or even more) cycles. learn more

27 January - 1 February 2018 RMT Ltd participates in SPIE Photonics West, the world's largest annual event for the photonics, laser, and biomedical optics industries held in The Moscone Center San Francisco, California, United States. Visit us at booth 138 to see the company products, to get to know about most recent company’s innovations and to meet in person RMT Ltd management. learn more

RMT INTRODUCES A NEW SERIES OF MINIATURE THERMOELECTRIC COOLERS learn more

6-9 September, 2017  RMT Ltd participates in China International Optoelectronic Exposition (CIOE 2017) in Shenzhen, China.
Visit us at in Shenzhen Convention and Exhibition Center, Booth 6006 (Hall 6)  to see the company's product range, to get to know about most recent company’s innovations and to meet in person RMT Ltd management.
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RMT Ltd. has finished regular complex Qualification Program 2016 of TECs and sub-mounts.
Its objective is to quantify the reliability of RMT’s thermoelectric coolers referred to the beginning of 2017, to prove the TEC reliability meeting the requirements of the Telcordia GR-468-CORE standard and RMT internal specifications TU 8420 001-34609988-12.
More than 1000 TECs of 10 types were exposed to the mechanical (vibration, mechanical shock, die shear strength, lead integrity), environmental (temperature cycling, high temperature storage, power cycling, insulation resistance) and electrical (thermo-physical parameters check) tests.
The test results indicate that TECs and sub-mounts manufactured by RMT meet the requirements both of Telcordia GR-468-CORE and TU 8420 001-34609988-12.
Complete Report on the Qualification Program 2016 (English version) will be available on request not later than January 20, 2017. Please, contact RMT for the copy. learn more

RMT Ltd introduce the updated line of thermoelectric sub-assemblies in standard PS-28 flatpack style package. Elongated shape, 28pins and large open area and many possible thermoelectric cooler solutions are optimal for CCD and CMOS detector applications. The available TEC solutions have cold side from 4x4mm2 to 12x24mm2 (or 17x17mm2). Single- and multistage TECs (with enlarged cold side) are available for advanced temperature stabilization. The sub-assemblies in PS-28 package are primary focused on linear image sensors with photodiode arrays - for example, CCD matrixes, InGaAs linear image sensors. However, the large number of pins in a package and wide range of possible thermoelectric coolers inside create a universal solution for many other applications as well.

RMT Ltd introduce more than 20 new thermoelectric coolers with holes for "external cooling". Term "external cooling" means TEC attached to the entire assembly on a header, rather than to a heat-generating object. There are two typical cases where thermoelectric coolers with holes can be used: 1) powerful LD on TO-38/46/56/9 type headers with not enough space to mount TEC on a header, 2) already sealed (un-cooled) devices, where the advanced temperature stabilization gives extra benefits in terms of laser wavelength stability, optical power output, device lifetime or sensitivity.